HBNP1268Q8 Datasheet, PDF (8/8 Pages) Cystech Electonics Corp. – General Purpose NPN / PNP Epitaxial Planar Transistors

SOP-8 Dimension
Top View
A
CYStech Electronics Corp.
Right side View
G
Marking:
Spec. No. : C198Q8
Issued Date : 2010.11.29
Revised Date :
Page No. : 8/8
I
Device Name
NP1268
B
CH
Date Code
□□□□
D
E
Front View
Part A
F
J
K
Part A _L
M
N
O
8-Lead SOP-8 Plastic Package
CYStek Package Code: Q8
DIM
Inches
Min.
Max.
A 0.1909 0.2007
B 0.1515 0.1555
C 0.2283 0.2441
D 0.0480 0.0519
E 0.0145 0.0185
F 0.1472 0.1527
G 0.0570 0.0649
H 0.1889 0.2007
Millimeters
Min.
Max.
4.85
5.10
3.85
3.95
5.80
6.20
1.22
1.32
0.37
0.47
3.74
3.88
1.45
1.65
4.80
5.10
DIM
Inches
Min.
Max.
I
0.0019 0.0078
J
0.0118 0.0275
K 0.0074 0.0098
L 0.0145 0.0204
M 0.0118 0.0197
N 0.0031 0.0051
O 0.0000 0.0059
*: Typical
Millimeters
Min.
Max.
0.05
0.20
0.30
0.70
0.19
0.25
0.37
0.52
0.30
0.50
0.08
0.13
0.00
0.15
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
HBNP1268Q8
CYStek Product Specification