BTD5974B3 Datasheet, PDF (8/8 Pages) Cystech Electonics Corp. – General Purpose NPN Epitaxial Planar Transistor

CYStech Electronics Corp.
TO-92SP Dimension
Spec. No. : C223B3
Issued Date : 2012.10.03
Revised Date :
Page No. : 8/8
Marking :
Device Name
Date Code
N^D4⁵4⁹0⁷1 ⁴
□□□□
3-Lead TO-92SP Plastic Package
CYStek Package Code: B3
Style: Pin 1.Emitter 2.Collector 3.Base
DIM
Millimeters
Min. Max.
A 1.420 1.620
A1 0.660 0.860
b 0.420 0.550
b1 0.360 0.480
c
0.360 0.510
D 3.900 4.100
Inches
Min. Max.
0.056 0.064
0.026 0.034
0.017 0.022
0.014 0.019
0.014 0.020
0.154 0.161
DIM
Millimeters
Min. Max.
D1 2.970 3.270
E 3.050 3.250
e
*1.270
e1 2.400 2.640
L 15.100 15.500
θ
*45°
*: Typical
Inches
Min. Max.
0.117 0.129
0.120 0.128
*0.050
0.096 0.104
0.594 0.610
*45°
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTD5974B3
CYStek Product Specification