BTD5974B3 Datasheet, PDF (6/8 Pages) Cystech Electonics Corp. – General Purpose NPN Epitaxial Planar Transistor

CYStech Electronics Corp.
TO-92SP Taping Outline
Spec. No. : C223B3
Issued Date : 2012.10.03
Revised Date :
Page No. : 6/8
DIM
A1
A
T
d
d1
P
P0
P2
F1,F2
△h
W
W0
W1
W2
H
H0
L1
D0
t1
t2
P1
△P
BTD5974B3
Item
Component body width
Component body height
Component body thickness
Lead wire diameter
Lead wire diameter 1
Pitch of component
Feed hole pitch
Hole center to component center
Lead to lead distance
Component alignment, F-R
Type width
Hole down tape width
Hole position
Hole down tape position
Height of component from tape center
Lead wire clinch height
Lead wire (tape portion)
Feed hole diameter
Taped lead thickness
Carrier tape thickness
Position of hole
Component alignment
Millimeters
Min.
Max.
3.80
4.20
2.95
3.35
1.32
1.72
0.33
0.43
0.41
0.51
12.40
13.00
12.50
12.90
6.05
6.65
2.20
2.80
-1.00
1.00
17.50
19.00
5.50
6.50
8.50
9.50
-
1.00
19.00
21.00
15.50
16.50
-
2.50
3.80
4.20
0.35
0.45
0.15
0.25
3.55
4.15
-1.00
1.00
CYStek Product Specification