HBN3904S6R_17 Datasheet, PDF (7/7 Pages) Cystech Electonics Corp. – Dual General Purpose NPN Transistors

CYStech Electronics Corp.
SOT-363 Dimension
Spec. No. : C228S6R
Issued Date : 2003.04.11
Revised Date : 2017.08.11
Page No. : 7/7
Marking:
● ^MA
Device
Code
Date
Code
6-Lead SOT-363 Plastic
Surface Mounted Package
CYStek Package Code: S6R
Style:
Pin 1. Emitter1 (E1)
Pin 2. Base1 (B1)
Pin 3. Collector2 (C2)
Pin 4. Emitter2 (E2)
Pin 5. Base2 (B2)
Pin 6. Collector1 (C1)
DIM
Millimeters
Min.
Max.
Inches
Min.
Max.
DIM
Millimeters
Min.
Max.
Inches
Min.
Max.
A
0.900 1.100 0.035 0.043 E1 2.150 2.450 0.085 0.096
A1 0.000 0.100 0.000 0.004
e
0.650 TYP
0.026 TYP
A2 0.900 1.000 0.035 0.039 e1 1.200 1.400 0.047 0.055
b
0.150 0.350 0.006 0.014
L
0.525 REF
0.021 REF
c
0.080 0.150 0.003 0.006 L1 0.260 0.460 0.010 0.018
D
2.000 2.200 0.079 0.087
θ
0°
8°
0°
8°
E
1.150 1.350 0.045 0.053
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : Pure tin plated.
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
HBN3904S6R
CYStek Product Specification