BU941ZF3 Datasheet, PDF (6/6 Pages) Cystech Electonics Corp. – NPN Epitaxial Planar Transistor

CYStech Electronics Corp.
TO-263 Dimension
Spec. No. : C660F3
Issued Date : 2010.10.01
Revised Date : 2014.02.13
Page No. : 6/6
A
C
2
B
D
123
I
J
K
L
E
α1
F
α2
G
H
α3
Marking :
Device Name
Year Code:
9→2009, 0→
2010,…, etc
Month Code:
1→Jan, 2→
Feb,…,9→
Sep, A→Oct,
B→Nov, C→
Dec
Style : Pin 1.Base 2.Collector 3.Emitter
3-Lead Plastic Surface Mounted Package
CYStek Package Code : F3
DIM
Inches
Min.
Max.
A 0.3800 0.4050
B 0.3300 0.3700
C
-
0.0550
D 0.5750 0.6250
Millimeters
Min.
Max.
9.65
10.29
8.38
9.40
-
1.40
14.61 15.88
DIM
Inches
Min.
Max.
I
0.0500 0.0700
J
-
*0.1000
K 0.0450 0.0550
L 0.0200 0.0390
*:Typical
Millimeters
Min.
Max.
1.27
1.78
-
*2.54
1.14
1.40
0.51
0.99
E 0.1600 0.1900 4.06
4.83
α1
-
-
6°
8°
F 0.0450 0.0550 1.14
1.40
α2
-
-
6°
8°
G 0.0900 0.1100 2.29
2.79
α3
-
H 0.0180 0.0290 0.46
0.74
-
0°
5°
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : Pure tin plated.
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BU941ZF3
CYStek Product Specification