BTB857D3 Datasheet, PDF (6/6 Pages) Cystech Electonics Corp. – Low Vcesat PNP Epitaxial Planar Transistor

CYStech Electronics Corp.
TO-126ML Dimension
Marking:
Spec. No. : C601D3
Issued Date : 2008.12.23
Revised Date :
Page No. : 6/6
Device
Name
B857
□□
Date
Code
Style: Pin 1.Emitter 2.Collector 3.Base
3-Lead TO-126ML Plastic Package
CYStek Package Code: D3
DIM
Inches
Min.
Max.
A 0.118
0.134
A1 0.071
0.087
b 0.026
0.034
b1 0.046
0.054
c 0.018
0.024
D 0.307
0.323
E 0.425
0.441
Millimeters
Min.
Max.
DIM
3.000 3.400
e
1.800 2.200 e1
0.660 0.860
L
1.170 1.370 L1
0.450 0.600 P
7.800 8.200 Φ1
10.800 11.200 Φ2
Inches
Min.
Max.
*0.090
0.176
0.183
0.594
0.610
0.051
0.059
0.159
0.167
0.118
0.126
0.122
0.130
*: Typical
Millimeters
Min.
Max.
*2.28
4.460
4.660
15.100 15.500
1.300
1.500
4.040
4.240
3.000
3.200
3.100
3.300
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: KFC ; pure tin plated
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTB857D3
CYStek Product Specification