BTB772NUT3 Datasheet, PDF (6/6 Pages) Cystech Electonics Corp. – Low Vcesat PNP Epitaxial Planar Transistor

CYStech Electronics Corp.
TO-126 Dimension
Marking:
Spec. No. : C631T3
Issued Date : 2017.04.18
Revised Date:
Page:6/6
B772
P □□
Date Code
Style: Pin 1.Emitter 2.Collector 3.Base
3-Lead TO-126 Plastic Package
CYStek Package Code: T3
DIM
Millimeters
Min.
Max.
A
2.500 2.900
A1 1.100 1.500
b
0.660 0.860
b1 1.170 1.370
c
0.450 0.600
D
7.400 7.800
E 10.600 11.000
Inches
Min.
Max.
0.098 0.114
0.043 0.059
0.026 0.034
0.046 0.054
0.018 0.024
0.291 0.307
0.417 0.433
DIM
Millimeters
Min.
Max.
e
*2.290
e1 4.480 4.680
h
0.000 0.300
L 15.300 15.700
L1 2.100 2.300
P
3.900 4.100
Φ
3.000 3.200
*: Typical
Inches
Min.
Max.
*0.090
0.176 0.184
0.000 0.012
0.602 0.618
0.083 0.091
0.154 0.161
0.118 0.126
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTB772NUT3
CYStek Product Specification