BTD2118LJ3 Datasheet, PDF (5/5 Pages) Cystech Electonics Corp. – CYStech Electronics Corp.

CYStech Electronics Corp.
TO-252 Dimension
Spec. No. : C850J3
Issued Date : 2004.02.27
Revised Date :2005.10.04
Page No. : 5/4
A
C
B
L
F
D
G
E
K
3
H
2
I
1
J
Marking:
2118L
Style: Pin 1.Base 2.Collector 3.Emitter
3-Lead TO-252 Plastic Surface Mount Package
CYStek Package Code: J3
DIM
Inches
Min. Max.
A 0.0177 0.0217
B 0.0650 0.0768
C 0.0354 0.0591
D 0.0177 0.0236
E 0.2520 0.2677
F 0.2125 0.2283
Millimeters
Min. Max.
0.45 0.55
1.65 1.95
0.90 1.50
0.45 0.60
6.40 6.80
5.40 5.80
*: Typical
DIM
Inches
Min. Max.
Millimeters
Min. Max.
G 0.0866 0.1102 2.20 2.80
H
- *0.0906 -
*2.30
I
-
0.0354
-
0.90
J
-
0.0315
-
0.80
K 0.2047 0.2165 5.20 5.50
L 0.0551 0.0630 1.40 1.60
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTD2118LJ3
CYStek Product Specification