DAN202S3 Datasheet, PDF (4/4 Pages) Cystech Electonics Corp. – High-speed double diode

CYStech Electronics Corp.
SOT-323 Dimension
Spec. No. : C303S3N
Issued Date : 2003.06.10
Revised Date
Page No. : 4/4
3
1
e1 bp
e
D
A
A1
Q
C
2
WB
Lp
detail Z
E
A
Z
θ
He
0
1
2 mm
scale
vA
Marking:
T_AE₄
3-Lead SOT-323 Plastic
Surface Mounted Package
CYStek Package Code: S3
Style : Pin 1. Anode 2.Anode
3. Common Cathode
DIM
Inches
Min. Max.
A 0.0315 0.0433
A1 0.0000 0.0039
bp 0.0118 0.0157
C 0.0039 0.0098
D 0.0709 0.0866
E 0.0453 0.0531
Millimeters
Min. Max.
0.80 1.10
0.00 0.10
0.30 0.40
0.10 0.25
1.80 2.20
1.15 1.35
DIM
Inches
Min. Max.
e1 0.0256
-
He 0.0787 0.0886
Lp 0.0059 0.0177
Q 0.0051 0.0091
v 0.0079
-
w 0.0079
-
*: Typical
Millimeters
Min. Max.
0.65
-
2.00 2.25
0.15 0.45
0.13 0.23
0.2
-
0.2
-
e 0.0512
-
1.3
-
θ-
-
10°
0°
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
DAN202S3
CYStek Product Specification