CSMC582XSC Datasheet, PDF (3/3 Pages) Cystech Electonics Corp. – 3.0Amp. Surface Mount Schottky Barrier Diodes

CYStech Electronics Corp.
SMC/DO-214AB Dimension
Spec. No. : C330SC
Issued Date : 2003.10.17
Revised Date :
Page No. : 3/3
Marking Code:
Device
Code
CSMC
5820
SK32
CSMC
5821
SK33
CSMC
5822
SK34
SMC/DO-214AB Plastic
Surface Mounted Package
CYStek Package Code:SC
DIM
Inches
Min. Max.
A 0.260 0.276
B 0.173 0.189
C
0.012(typ)
D 0.144 0.152
Millimeters
Min. Max.
DIM
Inches
Min. Max.
6.6
7.0
E 0.228 0.244
4.4
4.8
F 0.071 0.087
0.3(typ)
G
0.032(typ)
3.6
3.8
H
0.04(typ)
*:Typical
Millimeters
Min. Max.
5.8
6.2
1.8
2.2
0.8(typ)
1.0(typ)
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
CSMC582XSC
CYStek Product Specification