CSMC582XSC Datasheet, PDF (1/3 Pages) Cystech Electonics Corp. – 3.0Amp. Surface Mount Schottky Barrier Diodes

CYStech Electronics Corp.
3.0Amp. Surface Mount Schottky Barrier Diodes
CSMC582XSC Series
Spec. No. : C330SC
Issued Date : 2003.10.17
Revised Date :
Page No. : 1/3
Features
• For surface mounted applications.
• For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
• Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
• Low leakage current
• High surge capability
• High temperature soldering: 250°C/10 seconds at terminals
• Exceeds environmental standards of MIL-S-19500/228
Mechanical Data
• Case: Molded plastic, SMC/JEDEC DO-214AB.
• Terminals: Solder plated, solderable per MIL-STD-750 method 2026
• Polarity: Indicated by cathode band.
• Mounting Position : Any.
• Weight: 0.195 gram, 0.00585 ounce
Maximum Ratings and Electrical Characteristics
(Rating at 25°C ambient temperature unless otherwise specified. )
Parameter
Conditions
Repetitive peak reverse
voltage
Maximum RMS voltage
Maximum DC blocking
voltage
Maximum instantaneous
forward voltage
IF=3A (Note 1)
Maximum average forward
rectified current
Peak forward surge current
8.3ms single half sine wave superimposed
on rated load(JEDEC method)
Maximum DC reverse
VR=VRRM,TA=25℃(Note 1)
current
VR=VRRM,TA=125℃(Note 1)
Maximum thermal
resistance
Junction to ambient(Note 2)
Diode junction capacitance f=1MHz and applied 4V reverse voltage
Storage temperature
Operating temperature
Notes : 1.Pulse test, pulse width=300μsec, 2% duty cycle
2.Mounted on PCB with 14mm² (0.013mm thickness) copper pad area.
Type
Symbol CSMC CSMC CSMC Units
5820 5821 5822
VRRM 20 30 40 V
VRMS 14 21 28 V
VR 20 30 40 V
VF 0.475 0.500 0.525 V
IO
3
A
IFSM
IR
Rth,JA
CJ
Tstg
TJ
80
2
20
55 (typ)
300 (typ)
-55~+150
-55~+125
A
mA
mA
℃/w
pF
℃
℃
CSMC582XSC
CYStek Product Specification