CY8C24094_13 Datasheet, PDF (62/65 Pages) Cypress Semiconductor – PSoC® Programmable System-on-Chip™

CY8C24094, CY8C24794
CY8C24894, CY8C24994
18. Document History Page
Document Title: CY8C24094, CY8C24794, CY8C24894, CY8C24994 PSoC^® Programmable System-on-Chip™
Document Number: 38-12018
Revision ECN
Orig. of Submission
Change
Date
Description of Change
**
133189
NWJ 01/27/2004 New silicon and new document – Advance datasheet.
*A
251672
SFV
See ECN First Preliminary datasheet. Changed title to encompass only the CY8C24794
because the CY8C24494 and CY8C24694 are not being offered by Cypress.
*B
289742
HMT
See ECN Add standard DS items from SFV memo. Add Analog Input Mux on pinouts. 2
MACs. Change 512 bytes of SRAM to 1 K. Add dimension key to package.
Remove HAPI. Update diagrams, registers and specs.
*C
335236
HMT
See ECN Add CY logo. Update CY copyright. Update new CY.com URLs. Re-add ISSP
programming pinout notation. Add Reflow Temp. table. Update features (MAC,
Oscillator, and voltage range), registers (INT_CLR2/MSK2, second MAC), and
specs. (Rext, IMO, analog output buffer...).
*D
344318
HMT
See ECN Add new color and logo. Expand analog arch. diagram. Fix I/O #. Update
Electrical Specifications.
*E
346774
HMT
See ECN Add USB temperature specifications. Make datasheet Final.
*F
349566
HMT
See ECN Remove USB logo. Add URL to preferred dimensions for mounting MLF
packages.
*G
393164
HMT
See ECN Add new device, CY8C24894 56-pin MLF with XRES pin. Add Fimousb3v char.
to specs. Upgrade to CY Perform logo and update corporate address and
copyright.
*H
469243
HMT
See ECN Add ISSP note to pinout tables. Update typical and recommended Storage
Temperature per industrial specs. Update Low Output Level maximum I/OL
budget. Add FLS_PR1 to Register Map Bank 1 for users to specify which Flash
bank should be used for SROM operations. Add two new devices for a 68-pin
QFN and 100-ball VFBGA under RPNs: CY8C24094 and CY8C24994. Add two
packages for 68-pin QFN. Add OCD non-production pinouts and package
diagrams. Update CY branding and QFN convention. Add new Dev. Tool
section. Update copyright and trademarks.
*I
561158
HMT
See ECN Add Low Power Comparator (LPC) AC/DC electrical spec. tables. Add
CY8C20x34 to PSoC Device Characteristics table. Add detailed dimensions to
56-pin QFN package diagram and update revision. Secure one package
diagram/manufacturing per QFN. Update emulation pod/feet kit part numbers.
Fix pinout type-o per TestTrack.
*J
728238
HMT
See ECN Add CapSense SNR requirement reference. Update figure standards. Update
Technical Training paragraphs. Add QFN package clarifications and dimen-
sions. Update ECN-ed Amkor dimensioned QFN package diagram revisions.
Reword SNR reference. Add new 56-pin QFN spec.
*K
2552459 AZIE /
08/14/08 Add footnote on AGND descriptions to avoid using P2[4] for digital signaling as
PYRS
it may add noise to AGND. Remove reference to CMP_GO_EN1 in Map Bank
1 Table on Address 65; this register has no functionality on 24xxx. Add footnote
on die sales. Add description 'Optional External Clock Input’ on P1[4] to match
description of P1[4].
*L
2616550 OGNE / 12/05/08 Updated Programmable Pin Configuration detail.
PYRS
Changed title from PSoC® Mixed-Signal Array to PSoC® Programmable
System-on-Chip™
*M
2657956 DPT /
02/11/09 Added package diagram 001-09618 and updated Ordering Information table
PYRS
Document Number: 38-12018 Rev. AG
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