CY8C24094_13 Datasheet, PDF (44/65 Pages) Cypress Semiconductor – PSoC® Programmable System-on-Chip™

CY8C24094, CY8C24794
CY8C24894, CY8C24994
10.5 Thermal Impedance
Table 37. Thermal Impedances per Package
Package
56-Pin QFN^[28]
68-Pin QFN^[28]
100-Ball VFBGA
100-Pin TQFP
Typical _JA ^[27]
12.93 °C/W
13.05 °C/W
65 °C/W
51 °C/W
10.6 Solder Reflow Peak Specifications
Table 38 shows the solder reflow temperature limits that must not be exceeded.
Table 38. Solder Reflow Specifications
Package
56-Pin QFN
68-Pin QFN
100-Ball VFBGA
100-Pin TQFP
Maximum Peak
Temperature (T_C)
260 °C
260 °C
260 °C
260 °C
Maximum Time
above T_C – 5 °C
30 seconds
30 seconds
30 seconds
30 seconds
Notes
27. T_J = T_A + POWER × _JA.
28. To achieve the thermal impedance specified for the QFN package, see the Application Notes for Surface Mount Assembly of Amkor's MicroLeadFrame (MLF) Packages
available at http://www.amkor.com.
Document Number: 38-12018 Rev. AG
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