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CY8C21234_07 Datasheet, PDF (41/42 Pages) Cypress Semiconductor – PSoC® Mixed-Signal Array
7. Sales and Service Information
Cypress Semiconductor
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San Jose, CA 95134
408.943.2600
Web Sites:
Company Information – http://www.cypress.com
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7.1 Revision History
Document Title: CY8C21234, CY8C21334, CY8C21434, CY8C21534, and CY8C21634 PSoC Mixed-Signal Array Final Data Sheet
Document Number: 38-12025
Revision
ECN #
Issue Date
Origin of
Change
Description of Change
**
227340 5/19/2004 HMT
New silicon and document (Revision **).
*A
235992 See ECN SFV
Updated Overview and Electrical Spec. chapters, along with revisions to the 24-pin pinout part.
Revised the register mapping tables. Added a SSOP 28-pin part.
Changed title to include all part #s. Changed 28-pin SSOP from CY8C21434 to CY8C21534.
*B
248572 See ECN SFV
Changed pin 9 on the 28-pin SSOP from SMP pin to Vss pin. Added SMP block to architecture
diagram. Update Electrical Specifications. Added another 32-pin MLF part: CY8C21634.
*C
277832 See ECN HMT
Verify data sheet standards from SFV memo. Add Analog Input Mux to applicable pin outs.
Update PSoC Characteristics table. Update diagrams and specs. Final.
*D
285293 See ECN HMT
Update 2.7V DC GPIO spec. Add Reflow Peak Temp. table.
*E
301739 See ECN HMT
DC Chip-Level Specification changes. Update links to new CY.com Portal.
329104 See ECN HMT
Re-add pinout ISSP notation. Fix TMP register names. Clarify ADC feature. Update Electrical
*F
Specifications. Update Reflow Peak Temp. table. Add 32 MLF E-PAD dimensions. Add ThetaJC to
Thermal Impedance table. Fix 20-pin package order number. Add CY logo. Update CY copyright.
*G
352736 See ECN HMT
Add new color and logo. Add URL to preferred dimensions for mounting MLF packages. Update
Transmitter and Receiver AC Digital Block Electrical Specifications.
*H
390152 See ECN HMT
Clarify MLF thermal pad connection info. Replace 16-pin 300-MIL SOIC with correct 150-MIL.
*I
413404 See ECN HMT
Update 32-pin QFN E-Pad dimensions and rev. *A. Update CY branding and QFN convention.
430185 See ECN HMT
Add new 32-pin 5x5 mm 0.60 thickness QFN package and diagram, CY8C21434-24LKXI. Update
*J
thermal resistance data. Add 56-pin SSOP on-chip debug non-production part, CY8C21001-
24PVXI. Update typical and recommended Storage Temperature per industrial specs. Update
copyright and trademarks.
677717 See ECN HMT
Add CapSense SNR requirement reference. Add new Dev. Tool section. Add CY8C20x34 to
*K
PSoC Device Characteristics table. Add Low Power Comparator (LPC) AC/DC electrical spec.
tables. Update rev. of 32-Lead (5x5 mm 0.60 MAX) QFN package diagram.
Distribution: External/Public
Posting: None
January 12, 2007
© Cypress Semiconductor Corp. 2004-2007 — Document No. 38-12025 Rev. *K
41
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