CYRF89235 Datasheet, PDF (40/45 Pages) Cypress Semiconductor – PRoC™ USB

CYRF89235
Packaging Information
This section illustrates the packaging specifications for the PRoC-USB device, along with the thermal impedances for each package.
Important Note
Emulation tools may require a larger area on the target PCB than the chip’s footprint.
Packaging Dimensions
Figure 19. 40-pin QFN (6 × 6 × 1.0 mm) LT40B 3.5 × 3.5 mm E-Pad (Sawn) Package Outline, 001-13190
Document Number: 001-77748 Rev. *F
001-13190 *H
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