CY8C23433_08 Datasheet, PDF (35/37 Pages) Cypress Semiconductor – PSoC Programmable System-on-Chip

CY8C23433, CY8C23533
Figure 20. 28-Pin (210-Mil) SSOP
51-85079 *C
Thermal Impedances
Table 38. Thermal Impedances by Package
Package
32 QFN
28 SSOP
Typical θ_JA[22]
19.4°C/W
95°C/W
Capacitance on Crystal Pins
Table 39. Typical Package Capacitance on Crystal Pins
Package
32 QFN
28 SSOP
Package Capacitance
2.0 pF
2.8 pF
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 40. Solder Reflow Peak Temperature
Package
Minimum Peak Temperature ^[23] Maximum Peak Temperature
32 QFN
240°C
260°C
28 SSOP
240°C
260°C
Notes
22.
23.
T_J = T_A + POWER x
Higher temperatures
θ_JA.
may
be
required
based
on
the
solder
melting
point.
Typical
temperatures
for
solder
are
220
±
5^oC
with
Sn-Pb
or
245
±
5^oC
with
Sn-Ag-Cu
paste.
Refer to the solder manufacturer specifications.
Document Number: 001-44369 Rev. *B
Page 35 of 37
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