CY8C23433_08 Datasheet, PDF (34/37 Pages) Cypress Semiconductor – PSoC Programmable System-on-Chip

CY8C23433, CY8C23533
Packaging Information
This section illustrates the packaging specifications for the CY8C23x33 PSoC device, along with the thermal impedances for each
package, solder reflow peak temperature, and the typical package capacitance on crystal pins.
Figure 19. 32-Pin (5x5 mm) QFN
TOP VIEW
NOTES:
1.
HATCH AREA IS SOLDERABLE EXPOSED PAD
2. BASED ON REF JEDEC # MO-248
3. PACKAGE WEIGHT: 0.0388g
4. DIMENSIONS ARE IN MILLIMETERS
SIDE VIEW
SEE NOTE 1
BOTTOM VIEW
CYPRESS
COMPANY CONFIDENTIAL
TITLE 32L QFN 5 X 5 X 0.55 MM PACKAGE OUTLINE 3.5 X 3.5 EPAD
(SAWN TYPE)
001-42168 *C
SIZE
PART NO.
DWG NO
REV
A LQ32
001-42168 *C
Document Number: 001-44369 Rev. *B
Page 34 of 37
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