CY8C22113_04 Datasheet, PDF (34/36 Pages) Cypress Semiconductor – PSoC™ Mixed Signal Array

CY8C22x13 Final Data Sheet
4. Packaging Information
X = 138 MIL
Y = 138 MIL
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Figure 4-6. 32-Lead (5x5 mm) MLF
4.2 Thermal Impedances
Table 4-1. Thermal Impedances per Package
Package
8 PDIP
8 SOIC
20 PDIP
20 SSOP
20 SOIC
32 MLF
* T_J = T_A + POWER x θ_JA
Typical θ_JA *
123 ^oC/W
185 ^oC/W
109 ^oC/W
117 ^oC/W
81 ^oC/W
22 ^oC/W
4.3 Capacitance on Crystal Pins
Table 4-2: Typical Package Capacitance on Crystal Pins
Package
Package Capacitance
8 PDIP
2.8 pF
8 SOIC
2.0 pF
20 PDIP
3.0 pF
20 SSOP
2.6 pF
20 SOIC
2.5 pF
32 MLF
2.0 pF
June 3, 2004
Document No. 38-12009 Rev. *E
51-85188 - **
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