CY8C27243_06 Datasheet, PDF (30/34 Pages) Cypress Semiconductor – PSoC® Mixed-Signal Array

4. Packaging Information
This chapter illustrates the packaging specifications for the CY8C27x43 automotive PSoC device, along with the thermal imped-
ances for each package and the typical package capacitance on crystal pins.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at
http://www.cypress.com/design/MR10161.
4.1 Packaging Dimensions
Figure 4-1. 20-Lead (210-Mil) SSOP
51-85077 *C
November 9, 2006
Document No. 38-12023 Rev. *D
30
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