CY7C1441AV33 Datasheet, PDF (30/31 Pages) Cypress Semiconductor – 36-Mbit (1M x 36/2M x 18/512K x 72) Flow-Through SRAM

CY7C1441AV33
CY7C1443AV33
CY7C1447AV33
Document History Page
Document Title: CY7C1441AV33/CY7C1443AV33/CY7C1447AV33 36-Mbit (1M x 36/2M x 18/512K x 72) Flow-Through
SRAM
Document Number: 38-05357
REV.
Orig. of
ECN NO. Issue Date Change
Description of Change
**
124459 03/06/03 CJM New Data Sheet
*A
254910 See ECN SYT Part number changed from previous revision. New and old part number differ
by the letter “A”
Modified Functional Block diagrams
Modified switching waveforms
Added Footnote #13 (32-Bit Vendor I.D Code changed)
Added Boundary scan information
Added I_DD, I_X and I_SB values in the DC Electrical Characteristics
Added t_POWER specifications in Switching Characteristics table
Removed 119 PBGA Package
Changed 165 FBGA Package from BB165C (15 x 17 x 1.20 mm) to BB165
(15 x 17 x 1.40 mm)
Changed 209-Lead PBGA BG209 (14 x 22 x 2.20 mm) to BB209A
(14 x 22 x 1.76 mm)
*B
300131 See ECN SYT Removed 150 and 117 MHz Speed Bins
Changed Θ_JA and Θ_JC from TBD to 25.21 and 2.58 °C/W respectively for
TQFP Package on Pg # 21
Added lead-free information for 100-pin TQFP, 165 FBGA and 209 BGA
Packages.
Added comment of ‘Lead-free BG and BZ packages availability’ below the
Ordering Information
*C
320813 See ECN SYT Changed H9 pin from V_SSQ to V_SS on the Pin Configuration table for 209 FBGA
Changed the test condition from V_DD = Min. to V_DD = Max for V_OL in the
Electrical Characteristics table.
Replaced the TBD’s for I_DD, I_SB1, I_SB2, I_SB3 and I_SB4 to their respective values.
Replaced TBD’s for Θ_JA and Θ_JC to their respective values for 165 fBGA and
209 fBGA packages on the Thermal Resistance table.
Changed C_IN,C_CLK and C_I/O to 6.5, 3 and 5.5 pF from 5, 5 and 7 pF for TQFP
Package.
Removed “Lead-free BG and BZ packages availability” comment below the
Ordering Information
*D
331551 See ECN SYT Modified Address Expansion balls in the pinouts for 165 FBGA and 209 BGA
Packages as per JEDEC standards and updated the Pin Definitions accord-
ingly
Modified V_OL, V_OH test conditions
Replaced TBD to 100 mA for I_DDZZ
Changed C_IN, C_CLK and C_I/O to 7, 7and 6 pF from 5, 5 and 7 pF for 165 FBGA
Package.
Added Industrial Temperature Grade
Changed I_SB2 and I_SB4 from 100 and 110 mA to 120 and 135 mA respectively
Updated the Ordering Information by shading and unshading MPNs as per
availability
*E
417547 See ECN RXU Converted from Preliminary to Final.
Changed address of Cypress Semiconductor Corporation on Page# 1 from
“3901 North First Street” to “198 Champion Court”.
Changed I_X current value in MODE from –5 & 30 µA to –30 & 5 µA respectively
and also Changed I_X current value in ZZ from –30 & 5 µA to –5 & 30 µA
respectively on page# 19.
Modified test condition in note# 8 from V_IH < V_DD to V_IH < V_DD.
Modified “Input Load” to “Input Leakage Current except ZZ and MODE” in the
Electrical Characteristics Table.
Replaced Package Name column with Package Diagram in the Ordering
Information table.
Replaced Package Diagram of 51-85050 from *A to *B
Updated the Ordering Information.
Document #: 38-05357 Rev. *F
Page 30 of 31
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