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CY7C1371DV33 Datasheet, PDF (26/29 Pages) Cypress Semiconductor – 18-Mbit (512 K x 36) Flow-Through SRAM with NoBL™ Architecture
CY7C1371DV33
Package Diagrams (continued)
Figure 9. 165-ball FBGA (13 × 15 × 1.4 mm) BB165D/BW165D (0.5 Ball Diameter) Package Outline, 51-85180
Document Number: 001-75433 Rev. *A
51-85180 *F
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