CY8C20234 Datasheet, PDF (23/32 Pages) Cypress Semiconductor – PSoC® Mixed-Signal Array

3. Packaging Information
This chapter illustrates the packaging specifications for the CY8C20x34 PSoC device, along with the thermal impedances for each
package.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at
http://www.cypress.com/design/MR10161.
3.1 Packaging Dimensions
Figure 3-1. 16-Lead (3x3 mm x 0.6 MAX) QFN -- Preliminary
001-09116 **
September 18, 2006
Document No. 001-05356 Rev. *B
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