CYIS1SM0250-AA Datasheet, PDF (22/24 Pages) Cypress Semiconductor – 250K Pixel Radiation Hard CMOS Image Sensor

CYIS1SM0250-AA
Soldering and Handling
Soldering and Handling Conditions
Take special care when soldering image sensors onto a circuit
board. Prolonged heating at elevated temperatures may result
in deterioration of the performance of the sensor. The following
recommendations are made to ensure that sensor
performance is not compromised during end users' assembly
processes.
Board Assembly
The STAR250 is very sensitive to ESD. Device placement onto
boards should be done in accordance with strict ESD controls
for Class 0, JESD22 Human Body Model, and Class A,
JESD22 Machine Model devices. Assembly operators need to
always wear all designated and approved grounding
equipment; grounded wrist straps at ESD protected
workstations are recommended including the use of ionized
blowers. All tools should be ESD protected.
Manual Soldering
When a soldering iron is used the following conditions should
be observed:
Use a soldering iron with temperature control at the tip. The
soldering iron tip temperature should not exceed 350°C.
The soldering period for each pin should be less than five
seconds.
Reflow Soldering
Reflow soldering is not allowed.
Precautions and Cleaning
Avoid spilling solder flux on the cover glass; bare glass and
particularly glass with antireflection filters may be harmed by
the flux. Avoid mechanical or particulate damage to the cover
glass.
Use isopropyl alcohol (IPA) as a solvent for cleaning the image
sensor glass lid. When using other solvents, it should be
confirm whether the solvent will dissolve the package and/or
the glass lid.
RoHS (lead free) Compliance
This paragraph reports the use of Hazardous chemical
substances as required by the RoHS Directive (excluding
packing material).
Table 18. Chemical Substances in STAR250 Sensor
Chemical Substance
Any intentional content
If there is any intentional content, in which portion
is it contained?
Lead
NO
-
Cadmium
NO
-
Mercury
NO
-
Hexavalent chromium
NO
-
PBB (Polybrominated biphenyls)
NO
-
PBDE (Polybrominated diphenyl ethers)
NO
-
Information on Lead Free Soldering
The product cannot withstand a lead free soldering process.
Reflow or wave soldering is not allowed. Hand soldering only.
Solder 1 pin on each side of the sensor and let it cool down for
at least 1 minute before continuing
Note: "Intentional content" is defined as any material
demanding special attention is contained into the inquired
product by these cases:
1. A case that the above material is added as a chemical
composition into the inquired product intentionally in order
to produce and maintain the required performance and
function of the intended product
2. A case that the above material, which is used intentionally
in the manufacturing process, is contained in or adhered to
the inquired product.
The following case is not treated as "intentional content":
A case that the above material is contained as an impurity into
raw materials or parts of the intended product. The impurity is
defined as a substance that cannot be removed industrially, or
it is produced at a process like chemical composing or reaction
and it cannot be removed technically.
Document Number: 38-05713 Rev. *B
Page 22 of 24
[+] Feedback