English
Language : 

CY2XP21ZXC Datasheet, PDF (2/7 Pages) Cypress Semiconductor – 125 MHz LVPECL Clock Generator
PRELIMINARY
CY2XP21
Frequency Table
Crystal Frequency (MHz)
25
26.6
Inputs
PLL Multiplier Value
5
5
Output Frequency (MHz)
125
133
Absolute Maximum Conditions
Parameter
Description
VDD
VIN[1]
TS
TJ
ESDHBM
UL–94
ΘJA[2]
Supply Voltage
Input Voltage, DC
Temperature, Storage
Temperature, Junction
ESD Protection, Human Body Model
Flammability Rating
Thermal Resistance, Junction to Ambient
Conditions
Relative to VSS
Non operating
JEDEC STD 22-A114-B
At 1/8 in.
0 m/s airflow
1 m/s airflow
2.5 m/s airflow
Min
Max
–0.5
4.4
–0.5
–65
VDD + 0.5
150
135
2000
V–0
100
91
87
Unit
V
V
°C
°C
V
°C/W
Operating Conditions
Parameter
Description
Min
Max
Unit
VDD
3.3V Supply Voltage
2.5V Supply Voltage
3.135
3.465
V
2.375
2.625
V
TA
Ambient Temperature, Commercial
Ambient Temperature, Industrial
0
70
°C
–40
85
°C
TPU
Power up time for all VDD to reach minimum specified voltage (ensure power ramps 0.05
500
ms
is monotonic)
DC Electrical Characteristics
Parameter
Description
Test Conditions
Min
Typ
Max
Unit
IDD[4]
VOH
VOL
VOD1
VOD2
VOCM
Operating Supply Current with VDD = 3.465V, Output terminated
–
output terminated
VDD = 2.625V, Output terminated
–
–
150
mA
–
145
mA
LVPECL Output High Voltage VDD = 3.3V or 2.5V, RTERM = 50Ω to VDD –1.15
–
VDD – 2.0V
VDD –0.75
V
LVPECL Output Low Voltage
VDD = 3.3V or 2.5V, RTERM = 50Ω to VDD –2.0
VDD – 2.0V
–
VDD –1.625 V
LVPECL Peak-to-Peak Output VDD = 3.3V or 2.5V, RTERM = 50Ω to 600
–
1000
mV
Voltage Swing
VDD – 2.0V
LVPECL Output Voltage Swing VDD = 2.5V, RTERM = 50Ω to VDD –
500
–
1000
mV
(VOH - VOL)
1.5V
LVPECL Output Common Mode VDD = 2.5V, RTERM = 50Ω to VDD –
1.2
–
Voltage (VOH + VOL)/2
1.5V
–
V
CINX
Pin Capacitance, XIN & XOUT
4.5
pF
Notes
1. The voltage on any input or IO pin cannot exceed the power pin during power up.
2. Simulated using Apache Sentinel TI software. The board is derived from the JEDEC multilayer standard. It measures 76 x 114 x 1.6 mm and has 4-layers of
copper (2/1/1/2 oz.). The internal layers are 100% copper planes, while the top and bottom layers have 50% metalization. No vias are included in the model.
3. IDD includes approximately 24 mA of current that is dissipated externally in the output termination resistors.
Document #: 001-52849 Rev. *A
Page 2 of 7
[+] Feedback