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CY7C1364CV33 Datasheet, PDF (11/21 Pages) Cypress Semiconductor – 9-Mbit (256 K × 32) Pipelined Sync SRAM | |||
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CY7C1364CV33
Electrical Characteristics (continued)
Over the Operating Range
Parameter [9, 10]
Description
Test Conditions
Min
ISB3
Automatic CE Power-Down
VDD = Max, Device Deselected, 6-ns cycle,
â
Current â CMOS Inputs
VIN ï£ 0.3 V or VIN > VDDQ â 0.3 V, 166 MHz
f = fMAX = 1/tCYC
ISB4
Automatic CE Power-down
VDD = Max, Device Deselected, 6-ns cycle,
â
Current â TTL Inputs
VIN ï³ VIH or VIN ï£ VIL, f = 0
166 MHz
Max Unit
100
mA
40
mA
Capacitance
Parameter [11]
Description
CIN
CCLK
CI/O
Input Capacitance
Clock Input Capacitance
Input/Output Capacitance
Thermal Resistance
Parameter [11]
Description
ïJA
Thermal Resistance
(Junction to Ambient)
ïJC
Thermal Resistance
(Junction to Case)
Test Conditions
TA = 25 °C, f = 1 MHz, VDD = 3.3 V, VDDQ = 2.5 V
100-pin TQFP
Max.
Unit
5
pF
5
pF
5
pF
Test Conditions
100-pin TQFP
Package
Unit
Test conditions follow standard test methods and
procedures for measuring thermal impedance, per
EIA/JESD51
29.41
6.13
ï°C/W
ï°C/W
AC Test Loads and Waveforms
Figure 2. AC Test Loads and Waveforms
3.3V I/O Test Load
OUTPUT
Z0 = 50ï
3.3V
OUTPUT
RL = 50ï
5 pF
VT = 1.5V
(a)
INCLUDING
JIG AND
SCOPE
2.5V I/O Test Load
OUTPUT
2.5V
Z0 = 50ï
OUTPUT
RL = 50ï
5 pF
VT = 1.25V
(a)
INCLUDING
JIG AND
SCOPE
R = 317ï
R = 351ï
VDDQ
GND
ALL INPUT PULSES
10%
90%
ï£ 1 ns
90%
10%
ï£ 1 ns
(b)
(c)
R = 1667ï
R =1538ï
VDDQ
GND
ALL INPUT PULSES
10%
90%
ï£ 1 ns
90%
10%
ï£ 1 ns
(b)
(c)
Note
11. Tested initially and after any design or process change that may affect these parameters.
Document Number: 001-74576 Rev. *B
Page 11 of 21
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