CYIH1SM1000AA-HHCS Datasheet, PDF (1/71 Pages) Cypress Semiconductor – Detailed Specification - ICD

CYIH1SM1000AA-HHCS
Detailed Specification - ICD
1. Introduction
1.1 Scope
This version of the ICD is the version generated after qualifi-
cation campaign closure.
This specification details the ratings, physical, geometrical,
electrical and electro-optical characteristics, test- and
inspection-data for the High Accuracy Star Tracker (HAS)
Version 2 CMOS Active Pixel image Sensor (CMOS APS).
The device described in this document is protected by US patent
6,225,670 and others.
1.2 Component Type Variants
A summary of the type variants of the basic CMOS image sensor
is given in Table 1 on page 8. The complete list of detailed speci-
fications for each type variant is given in Table 3 on page 9 for
each type separately.
All specifications in Table 3 on page 9 are given at 25 ± 3°C,
under nominal clocking and bias conditions. Exceptions are
noted in the 'remarks' field.
1.3 Maximum Rating
The maximum ratings which shall not be exceeded at any time
during use or storage are as scheduled in Table 2 on page 9.
1.4 Physical Dimensions and Geometrical Information
The physical dimensions of the assembled component are
shown in Figure 2 on page 25. The geometrical information in
Figure 4 on page 26 describes the position of the die in the
package.
1.5 Pin Assignment
Figure 6 on page 27 contains the pin assignment. The figure
contains a schematic drawing and a pin list. A detailed functional
description of each pin can be found in “Pin List” on page 39.
1.6 Soldering Instructions
Soldering is restricted to manual soldering only. No wave or
reflow soldering is allowed. For the manual soldering, following
restrictions are applicable:
■ Solder 1 pin on each of the 4 sides of the sensor.
■ Cool down period of min. 1 minute before soldering another pin
on each of the 4 sides.
■ Repeat soldering of 1 pin on each side, including a 1 minute
cool down period.
1.7 Handling Precautions
The component is susceptible to damage by electro-static
discharge. Therefore, suitable precautions shall be employed for
protection during all phases of manufacture, testing, packaging,
shipment and any handling. The following guidelines are appli-
cable:
■ Always manipulate the devices in an ESD controlled
environment.
■ Always store the devices in a shielded environment that
protects against ESD damage (at least a non-ESD generating
tray and a metal bag).
■ Always wear a wrist strap when handling the devices and use
ESD safe gloves.
■ The HAS2 is classified as class 1A (JEDEC classification -
[AD03]) device for ESD sensitivity.
1.8 Storage Information
The components must be stored in a dust-free and temperature-,
humidity and ESD controlled environment.
■ Devices must always be stored in special ESD-safe trays such
that the glass window is never touched.
■ The trays are closed with EDS-safe rubber bands.
■ The trays are sealed in an ESD-safe conductive foil in clean
room conditions.
■ For transport and storage outside a clean room the trays are
packed in a second ESD-save bag that is sealed in clean room.
1.9 Procurement Requirements
The HAS2 image sensor can be procured at Cypress Semicon-
ductor or its distributors, using the following references:
■ Flight sensors: CYIH1SM1000AA-HHCS.
■ Engineering sensors: CYIH1SM1000AA-HHCES.
The HAS sensor is subject to the standard European export
regulations for dual use products.
A Certificate of Conformance will be issued upon request at no
additional charge. The CoC will refer to this Detailed Specifi-
cation.
Additional screening tests can be done upon request at
additional cost.
The following data is by default delivered with FM sensors:
■ Sensor calibration data
■ Temperature calibration data
■ Certificate of Conformance to this detailed specification
■ Visual inspection report
■ Bad pixel map
Cypress Semiconductor Corporation • 198 Champion Court
Document Number: 001-54123 Rev. *A
• San Jose, CA 95134-1709 • 408-943-2600
Revised September 18, 2009
[+] Feedback