CY7C1516KV18_11 Datasheet, PDF (1/33 Pages) Cypress Semiconductor – 72-Mbit DDR II SRAM 2-Word Burst Architecture

CY7C1516KV18, CY7C1527KV18
CY7C1518KV18, CY7C1520KV18
72-Mbit DDR II SRAM 2-Word
Burst Architecture
Features
Functional Description
■ 72-Mbit density (8M x 8, 8M x 9, 4M x 18, 2M x 36)
■ 333 MHz clock for high bandwidth
■ Two-word burst for reducing address bus frequency
■ Double data rate (DDR) interfaces
(data transferred at 666 MHz) at 333 MHz
■ Two input clocks (K and K) for precise DDR timing
❐ SRAM uses rising edges only
■ Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
■ Echo clocks (CQ and CQ) simplify data capture in high speed
systems
■ Synchronous internally self-timed writes
■ DDR II operates with 1.5 cycle read latency when DOFF is
asserted HIGH
■ Operates similar to DDR I device with 1 cycle read latency when
DOFF is asserted LOW
■ 1.8 V core power supply with HSTL inputs and outputs
■ Variable drive HSTL output buffers
■ Expanded HSTL output voltage (1.4 V–V_DD)
❐ Supports both 1.5 V and 1.8 V IO supply
■ Available in 165-ball fine pitch ball grid array (FBGA) package
(13 x 15 x 1.4 mm)
■ Offered in both Pb-free and non Pb-free packages
■ JTAG 1149.1 compatible Test Access Port
■ Phase-locked loop (PLL) for accurate data placement
The CY7C1516KV18, CY7C1527KV18, CY7C1518KV18, and
CY7C1520KV18 are 1.8 V synchronous pipelined SRAM
equipped with DDR II architecture. The DDR II consists of an
SRAM core with advanced synchronous peripheral circuitry and
a 1-bit burst counter. Addresses for read and write are latched
on alternate rising edges of the input (K) clock. Write data is
registered on the rising edges of both K and K. Read data is
driven on the rising edges of C and C if provided, or on the rising
edge of K and K if C/C are not provided. Each address location
is associated with two 8-bit words in the case of CY7C1516KV18
and two 9-bit words in the case of CY7C1527KV18 that burst
sequentially into or out of the device. The burst counter always
starts with a “0” internally in the case of CY7C1516KV18 and
CY7C1527KV18. On CY7C1518KV18 and CY7C1520KV18, the
burst counter takes in the least significant bit of the external
address and bursts two 18-bit words in the case of
CY7C1518KV18 and two 36-bit words in the case of
CY7C1520KV18 sequentially into or out of the device.
Asynchronous inputs include an output impedance matching
input (ZQ). Synchronous data outputs (Q, sharing the same
physical pins as the data inputs D) are tightly matched to the two
output echo clocks CQ/CQ, eliminating the need for separately
capturing data from each individual DDR SRAM in the system
design. Output data clocks (C/C) enable maximum system
clocking and data synchronization flexibility.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
Configurations
CY7C1516KV18 – 8M x 8
CY7C1527KV18 – 8M x 9
CY7C1518KV18 – 4M x 18
CY7C1520KV18 – 2M x 36
Selection Guide
Description
333 MHz
Maximum Operating Frequency
333
Maximum Operating Current
x8
510
x9
510
x18
520
x36
640
300 MHz
300
480
480
490
600
250 MHz
250
420
420
430
530
200 MHz
200
370
370
380
450
167 MHz
167
340
340
340
400
Unit
MHz
mA
Cypress Semiconductor Corporation • 198 Champion Court
Document Number: 001-00437 Rev. *J
• San Jose, CA 95134-1709 • 408-943-2600
Revised April 10, 2011
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