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DS-72-04 Datasheet, PDF (15/16 Pages) Cymbet Corporation – EnerChip CC with Integrated Power Management
EnerChip CC CBC3112
CBC3112 7mm x 7mm DFN Package Drawing and Dimensions
Notes:
1. Dimensions in millimeters.
2. Package dimensions do not include mold flash, protrusions,
burrs or metal smearing.
3. Coplanarity applies to the exposed pad as well as the
exposed terminals. Maximum coplanarity shall be 0.08.
Warpage shall not exceed 0.10.
4. Refer to JEDEC MO-229 outline.
5. Exposed metallized feature connected to die paddle.
6. There are 10 contact pads on two opposite sides and no
contact pads on the other two sides.
Handling EnerChips as MSL 3 Devices
EnerChip CBC050 devices are rated Moisture Sensitivity Level 3 and must be mounted and reflowed within 168
hours of being removed from the moisture barrier antistatic bag.
Soldering, Rework, and Electrical Test
Refer to the Cymbet User Manual AN-1026 for soldering, rework, and replacement of the EnerChip on printed
circuit boards, and for instructions on in-circuit electrical testing of the EnerChip.
©2009-2014 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-04 Rev H
Page 15 of 16