CMPA2560025D Datasheet, PDF (3/9 Pages) Cree, Inc – 25 W, 2.5 - 6.0 GHz, GaN MMIC, Power Amplifier

Die Dimensions (units in microns)
Overall die size 3680 x 4560 (+0/-50) microns, die thickness 100 (+/-10) microns.
All Gate and Drain pads must be wire bonded for electrical connection.
Pad Number
1
2
3
4
5
6
7
8
9
10
Function
RF-IN
VG1_A
VG1_B
VD1_A
VD1_B
VG2_A
VG2_B
VD2_A
VD2_B
RF-Out
Description
RF-Input pad. Matched to 50 ohm. Requires gate control from an external bias –T from
-1.5 V to -2.5 V and external blocking capacitor.
Gate control for stage 1. V_G -1.5 - 2.5 V.
Gate control for stage 1. V_G -1.5 - 2.5 V.
Drain supply for stage 1. V_D = 26 V.
Drain supply for stage 1. V_D = 26 V.
Gate control for stage 2A. V_G -1.5 - 2.5 V.
Gate control for stage 2B. V_G -1.5 - 2.5 V.
Drain supply for stage 2A. V_D = 26 V.
Drain supply for stage 2B. V_D = 26 V.
This pad is DC blocked internally. The DC impedance ~ 0 ohm due output matching
circuit. Requires external matching circuit for optimal performance for f >4.0 GHz.
Pad Size (microns) Note
202 X 204
3
138 x 147
1,2
138 x 147
1,2
167 x 225
1
167 x 225
1
167 x 175
1
167 x 175
1
A
1
A
1
252 x 204
3
Notes:
1 _{Attach bypass capacitor to port 2-9 per application circuit.}
2 _{VG1_A and VG1_B is connected internally so it would be enough to connect either one for proper operation.}
3 _{The RF Input and Output pad have a ground-signal-ground with a pitch of 10 mil (250 um).}
Die Assembly Notes:
• Recommended solder is AuSn (80/20) solder. Refer to Cree’s website for the Eutectic Die Bond Procedure
application note at http://www.cree.com/products/wireless_appnotes.asp
• Vacuum collet is the preferred method of pick-up.
• The backside of the die is the Source (ground) contact.
• Die back side gold plating is 5 microns thick minimum.
• Thermosonic ball or wedge bonding are the preferred connection methods.
• Gold wire must be used for connections.
• Use the die label (XX-YY) for correct orientation.
Copyright © 2008-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
and the Cree logo are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their
respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association.
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CMPA2560025D Rev 1.3
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: [phone]
Fax: [phone]
www.cree.com/rf