XQ-E Datasheet, PDF (22/31 Pages) Cree, Inc – Cree XLamp XQ-E LEDs

XLamp^® XQ-E LED
Thermal Design - Continued
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end
product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life
and optical characteristics.
Thermal Design - HE photo red
high_Hde_in_gsi_hty _Density
HE Photo Red
1200
1000
800
600
400
Rj-a = 10°C/W
Rj-a = 15°C/W
200
Rj-a = 20°C/W
Rj-a = 25°C/W
0
0
20
40
60
80
100
120
140
160
Ambient Temperature (ºC)
Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree^® and XLamp^® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL^® and the UR logo are registered trademarks of UL LLC.
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