CC12H1A_16 Datasheet, PDF (8/8 Pages) Cooper Bussmann, Inc. – High I²t Chip fuses

Technical Data 4309
Effective April 2016
Solder reflow profile
TP
TL
Tsmax
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Preheat
A
Tsmin
ts
25°C
Time 25°C to Peak
Time
tP
t
CC12H
High I²t Chip fuses

TC -5°C
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm)
235°C
220°C
≥2.5mm
220°C
220°C
Table 2 - Lead (Pb) Free Solder (Tc)
Package
Thickness
Volume
mm³
<350
Volume
mm³
350 - 2000
<1.6mm
260°C
260°C
1.6 – 2.5mm
260°C
250°C
>2.5mm
250°C
245°C
Volume
mm³
>2000
260°C
245°C
245°C
Reference JDEC J-STD-020D
Profile Feature
Preheat and Soak • Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (Tl)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Standard SnPb Solder
100°C
150°C
60-120 Seconds
3°C/ Second Max.
183°C
60-150 Seconds
Table 1
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
Lead (Pb) Free Solder
150°C
200°C
60-120 Seconds
3°C/ Second Max.
217°C
60-150 Seconds
Table 2
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
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Electronics Division
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Cleveland, OH 44122
United States
www.eaton.com/elx
© 2016 Eaton
All Rights Reserved
Printed in USA
Publication No. 4309 BU-MC16040
April 2016
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