CC12H1A_16 Datasheet, PDF (7/8 Pages) Cooper Bussmann, Inc. – High I²t Chip fuses

CC12H
High I²t Chip fuses

Wave solder profile
T_p
t_p
First Wave
Second Wave
Technical Data 4309
Effective April 2016
T_smax
T_styp
T_smin
Preheat area
Time
Cool down area
Reference EN 61760-1:2006
Profile Feature
Preheat
• Temperature min. (Tsmin)
• Temperature typ. (Tstyp)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
D preheat to max Temperature
Peak temperature (TP)*
Time at peak temperature (tp)
Ramp-down rate
Time 25°C to 25°C
Standard SnPb Solder
100°C
120°C
130°C
70 seconds
150°C max.
235°C – 260°C
10 seconds max
5 seconds max each wave
~ 2 K/s min
~3.5 K/s typ
~5 K/s max
4 minutes
Manual solder
350°C, 4-5 seconds. (by soldering iron), generally manual, hand soldering is not recommended.
Lead (Pb) Free Solder
100°C
120°C
130°C
70 seconds
150°C max.
250°C – 260°C
10 seconds max
5 seconds max each wave
~ 2 K/s min
~3.5 K/s typ
~5 K/s max
4 minutes
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