CSRV065V0P_12 Datasheet, PDF (1/5 Pages) Comchip Technology – Low Capacitance ESD Protection Array

Low Capacitance ESD Protection Array
CSRV065V0P
RoHs Device
Features
-ESD Protect for 4 high-speed I/O channels.
-IEC61000-4-2 (ESD)±14kV(Contact),±18kV(Air).
-IEC61000-4-4 (FET)20A for I/O,80A for Power.
-Working voltage: 5V
-Low capacitance:1.3pF(Typ.).
-High component density.
Mechanical data
-Case: SC70-6L(SOT-363) standard package,
molded plastic.
-Terminals: Solder plated, solderable per
MIL-STD-750,method 2026.
-Mounting position: Any
-Weight: 0.0091 gram(approx.).
Circuit Diagram
5
1
3
2
Pin Configuration
6
4
6
5
4
SC70-6L(SOT-363)
0.087(2.20)
0.079(2.00)
0.053(1.35)
0.045(1.15)
0.055(1.40)
0.047(1.20)
0.039(1.00)
0.035(0.90)
0.014(0.35)
0.006(0.15)
0.004(0.10)max
0.006(0.15)
0.003(0.08)
0.096(2.45)
0.085(2.15)
0.010(0.26)min.
Dimensions in inches and (millimeters)
1
2
3
Maximum Ratings (at TA=25°C unless otherwise noted)
Parameter
Peak pulse current ( tp = 8/20 us)
Operating supply voltage
ESD per IEC 61000-4-2(Air)
ESD per IEC 61000-4-2(Contact)
ESD per IEC 61000-4-2(Air)(VDD-GND)
ESD per IEC 61000-4-2(Contact)(VDD-GND)
Lead soldering temperature
Operating temperature
Storage temperature
DC voltage at any I/O pin
Symbol
IPP
VDC
ESD
ESD_VDD
TSOL
Tj
TSTG
VIO
Value
6.5
6
18
14
30
260 ( 10 sec)
-55 to +85
-55 to +125
(GND -0.5) to (VDD +0.5)
Unit
A
V
kV
kV
°C
°C
°C
V
QW-BP010
Comchip Technology CO., LTD.
REV:C
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