CMX971 Datasheet, PDF (25/25 Pages) CML Microcircuits – Small 16-lead VQFN Package

Quadrature Modulator
CMX971
9.2 Packaging
Exposed
Metal Pad
DIM.
*^A
*
B
C
F
G
H
J
K
L
L1
P
T
MIN. TYP. MAX.
0.80
2.55
2.55
0.00
0.25
0.20
0.30
0
4.00 BSC
4.00 BSC
0.90
0.30
0.65
0.20
1.00
2.80
2.80
0.05
0.35
0.50
0.15
NOTE :
A & B are reference data and do
not include mold deflash or protrusions.
All dimensions in mm
Angles are in degrees
Index Area 1
Index Area 2
Dot
Dot
Chamfer
Index Area 1 is located directly above Index Area 2
Depending on the method of lead termination at the edge of the package, pull back (L1) may be present.
L minus L1 to be equal to, or greater than 0.3mm
The underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal
conductivity and mechanical strength of the package fixing. Where advised, an electrical connection to this metal pad may also
be required
Figure 13 Q7 Mechanical Outline: Order as part no. CMX971Q7
Handling precautions: This product includes input protection, however, precautions should be taken to prevent device damage
from electro-static discharge. CML does not assume any responsibility for the use of any circuitry described. No IPR or circuit
patent licences are implied. CML reserves the right at any time without notice to change the said circuitry and this product
specification. CML has a policy of testing every product shipped using calibrated test equipment to ensure compliance with
this product specification. Specific testing of all circuit parameters is not necessarily performed.