CPC1777 Datasheet, PDF (3/6 Pages) Clare, Inc. – i4-PAC™ DC Power Relay

CPC1777
Thermal Characteristics
Parameter
Thermal Resistance (junction to case)
Thermal Resistance (junction to ambient)
Junction Temperature (operation)
Conditions
Symbol
Min
Typ
Max Units
-
Free air
-
R_θJC
-
-
0.35
°C/W
R_θJA
-
40
-
°C/W
T_J
-40
-
100
°C
Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal
interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate
junction-to-ambient thermal resistance of 12.5°C/W.
Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Heat Sink Rating
R_θCA
=
(T_J
- T_A)
I²
L(99)
I_L2
R •
θJC
- R_θJC
T_J = Junction Temperature (°C), T_J ≤ 100°C *
T_A = Ambient Temperature (°C)
I_L(99) = Load Current with Case Temperature @ 99°C (A_rms)
I_L = Desired Operating Load Current (A_rms), I_L ≤ I_L(MAX)
R_θJC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W
R_θCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
* Elevated junction temperature reduces semiconductor lifetime.
R02
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