CPC7592 Datasheet, PDF (18/20 Pages) Clare, Inc. – Line Card Access Switch

CPC7592
3.1.2 16-Pin DFN
7.00 ± 0.25
(0.276 ± 0.01)
6.00 ± 0.25
(0.236 ± 0.01)
0.80
(0.032)
INDEX AREA
0.90 ± 0.10
(0.035 ± 0.004)
TOP VIEW
0.02, + 0.03, - 0.02
(0.0008, + 0.0012, - 0.0008)
1
SIDE VIEW
0.30 ± 0.05
(0.012 ± 0.002)
SEATING
PLANE
0.20
(0.008)
EXPOSED
METALLIC PAD
Terminal Tip
16
4.25 ± 0.05
(0.167 ± 0.002)
6.00 ± 0.05
(0.236 ± 0.002)
BOTTOM VIEW
0.55 ± 0.10
(0.022 ± 0.004)
Dimensions
mm
(inch)
3.2 Printed-Circuit Board Layout
3.2.1 16-Pin SOIC
1.27
(0.050)
3.2.2 16-Pin DFN
0.35
(0.014)
2.00
(0.079)
0.60
(0.024)
9.40
(0.370)
DIMENSIONS
mm
(inches)
1.05
(0.041)
5.80
(0.228)
0.80
(0.031)
DIMENSIONS
mm
(inches)
NOTE: As the metallic pad on the bottom of the DFN
package is connected to the substrate of the die, Clare
recommends that no printed circuit board traces or
vias be placed under this area to maintain minimum
creepage and clearance values.
18
www.clare.com
R03