CPC1909 Datasheet, PDF (1/6 Pages) Clare, Inc. – ISOPLUS™-264 Power Relay

CPC1909
ISOPLUS™-264 Power Relay
Parameter
Blocking Voltage
Load Current, T_A=25ºC
With 5°C/W Heat Sink
No Heat Sink
On-resistance
R_θJC
Rating
60
15
6.5
0.1
0.3
Units
V_P
A_rms
Ω
ºC/W
Features
• Compact ISOPLUS-264 Power Package
• Low Thermal Resistance (0.3 °C/W)
• 15A_rms Load Current with 5°C/W Heat Sink
• Electrically Non-conductive Thermal Pad for Heat
Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• 2500V_rms Input/Output Isolation
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Applications
• Industrial Controls
• Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
Pin Configuration
Description
Clare and IXYS have combined to bring OptoMOS^®
technology, reliability, and compact size to a new
family of high-power Solid State Relays.
As part of this family, the CPC1909 single pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 15A_rms continuous load current with a
5ºC/W heat sink.
The CPC1909 employs optically coupled MOSFET
technology to provide 2500V_rms of input to output
isolation. The output is constructed with efficient
MOSFET switches and photovoltaic die that use
Clare’s patented OptoMOS architecture while the
input, a highly efficient GaAlAs infrared LED provides
the optically coupled control. The combination of
low on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique ISOPLUS-264 package pioneered
by IXYS allows Solid State Relays to achieve the
highest load current and power ratings. This package
features a unique IXYS process where the silicon
chips are soft soldered onto the Direct Copper
Bond (DCB) substrate instead of the traditional
copper leadframe. The DCB ceramic, the same
substrate used in high power modules, not only
provides 2500V_rms isolation but also very low thermal
resistance (0.3 °C/W).
Approvals
• UL recognized component: File # E69938
• Certified to: UL 508
Ordering Information
Part Number Description
CPC1909J
ISOPLUS-264 (25 per tube)
Switching Characteristics of
Normally Open (Form A) Devices
RoHS
2002/95/EC
e3
DS-CPC1909-R03
CONTROL
I_LOAD
+90%
10%+
T_ON ^TOFF
www.clare.com
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