CS42L73 Datasheet, PDF (7/7 Pages) Cirrus Logic – Ultra Low Power Mobile Audio and Telephony CODEC

3. THERMAL CHARACTERISTICS
CS42L73
Parameter (Notes 1 and 2)
WLCSP Package
Junction to Ambient Thermal Impedance
FBGA Package
Junction to Ambient Thermal Impedance
Symbol Min Typ Max Units
_JA
-
43
-
°C/Watt
_JA
-
58
-
°C/Watt
Notes:
1. Test Printed Circuit Board Assembly (PCBA) constructed in accordance with JEDEC standard JESD51-9.
Two signal, two plane (2s2p) PCB utilized.
2. Test conducted with still air in accordance with JEDEC standards JESD51, JESD51-2A, and JESD51-8.
4. ORDERING INFORMATION
Product
CS42L73
Description
Ultra Low Power Mobile
Audio and Telephony
CODEC
Package Pb-Free Grade
Temp
Range
64 Ball
WLCSP
65 Ball
FBGA
YES
Commercial
-40
to
+85 °C
Container Order #
Tray CS42L73-CWZ
Tape & Reel CS42L73-CWZR
Tray CS42L73-CRZ
Tape & Reel CS42L73-CRZR
Contacting Cirrus Logic Support
For all product questions and inquiries, contact a Cirrus Logic Sales Representative.
To find one nearest you, go to www.cirrus.com.
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“Advance” product information describes products that are in development and subject to development changes. Cirrus Logic, Inc. and its subsidiaries (“Cirrus”) be-
lieve that the information contained in this document is accurate and reliable. However, the information is subject to change without notice and is provided “AS IS”
without warranty of any kind (express or implied). Customers are advised to obtain the latest version of relevant information to verify, before placing orders, that
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