English
Language : 

WM8224 Datasheet, PDF (6/50 Pages) Wolfson Microelectronics plc – 60MSPS 3-Channel AFE with Multiple Device Operation and Programmable Automatic Black Level Calibration
WM8224
Production Data
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at
or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical
Characteristics at the test conditions specified.
ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible
to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage
of this device.
Wolfson tests its package types according to IPC/JEDEC J-STD-020 for Moisture Sensitivity to determine acceptable storage
conditions prior to surface mount assembly. These levels are:
MSL1 = unlimited floor life at <30C / 85% Relative Humidity. Not normally stored in moisture barrier bag.
MSL2 = out of bag storage for 1 year at <30C / 60% Relative Humidity. Supplied in moisture barrier bag.
MSL3 = out of bag storage for 168 hours at <30C / 60% Relative Humidity. Supplied in moisture barrier bag.
The Moisture Sensitivity Level for each package type is specified in Ordering Information.
CONDITION
MIN
MAX
Analogue supply voltage: AVDD
GND - 0.3V
GND + 5V
Digital supply voltage: DVDD
GND - 0.3V
GND + 5V
Digital ground: DGND
GND - 0.3V
GND + 0.3V
Analogue grounds: AGND1  2
GND - 0.3V
GND + 0.3V
Analogue inputs (RINP, GINP, BINP)
GND - 0.3V
AVDD + 0.3V
Other Analogue pins
GND - 0.3V
AVDD + 0.3V
Digital I/O pins
GND – 0.3V
DVDD + 0.3V
Operating temperature range: TA
0C
+70C
Storage temperature prior to soldering
30C max / 85% RH max
Storage temperature after soldering
-65C
+150C
Notes:
1.
GND denotes the voltage of any ground pin.
2.
AGND1, AGND2 and DGND pins are intended to be operated at the same potential. Differential voltages
between these pins will degrade performance.
RECOMMENDED OPERATING CONDITIONS
CONDITION
Operating temperature range
Analogue supply voltage
Digital core and I/O supply voltage
SYMBOL
MIN
TYP
MAX
UNITS
TA
0
70
C
AVDD
2.97
3.3
3.63
V
DVDD
2.97
3.3
3.63
V
THERMAL PERFORMANCE
PARAMETER
SYMBOL TEST CONDITIONS
MIN
Performance
Thermal resistance – junction to
RθJC
case
Thermal resistance – junction to
RθJA
ambient
Tambient = 25°C
TYP
10.27
29.45
MAX
Notes:
Figure 3 Figures given are for package mounted on 4-layer FR4 according to JESD51-5 and JESD51-7.
UNIT
°C/W
°C/W
w
PD, Rev 4.2, September 2013
6