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CS4216 Datasheet, PDF (50/58 Pages) Cirrus Logic – 16-Bit Stereo Audio Codec
CDB4216
Notice in Figure 12 and Figure 13 how the
ground plane split is positioned. The split is
next to the part - NOT UNDER IT. The AGND
and DGND pins are connected to the ground
plane fill inside the codec pad layout on the
component-side layer. This is recommended be-
cause AGND and DGND are connected on the
codec die and must have a zero impedance be-
tween them.
Notice how each ground connection has at least
four points in thermal relief. The main board
grounds at the terminal connections have eight
points in thermal relief. This helps minimize the
impedance to the main ground terminal from any
particular ground pin, reducing the chance of
noise coupling.
Another important design consideration is the
ground plane fill between traces on both layers,
which minimizes coupling of radiated energy.
Ground fill on the digital side of the board helps
reduce the amount of noisy digital energy radi-
ated to the sensitive analog side and to a host
system. Ground fill on the analog side helps re-
duce the amount of radiated digital energy that is
coupled into the analog circuitry. All ground
plane fills must be connected to their respective
grounds - floating ground fill is worse than no
fill.
All power and ground traces are as thick as the
surface mount pads they connect. Thick traces
minimize impedance, thereby reducing the
chance of noise coupling.
Decoupling
Notice how the decoupling capacitors are placed
as close as possible to the codec. The 0.1µF ca-
pacitors are placed closer than the 10µF or 1µF
capacitors. This reduces lead inductance at high
frequencies and allows the smaller valued ca-
pacitors to attenuate unwanted signals more
effectively.
Sockets
The CDB4216/8 was designed to accommodate
either the 44-pin PLCC package or the 44-pin
TQFP package. Each evaluation board is
shipped with a PLCC codec loaded into a sur-
face mount socket. Notice how the socket pads
match the footprint of the PLCC package. Using
this socket in a design allows for testing with the
socket mounted, and the option to surface mount
the codec directly for cost reduction during
board production.
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DS83DB4