CPD31X Datasheet, PDF (2/2 Pages) Central Semiconductor Corp – 10A, 60V Schottky Rectifi er Die

CPD31X
CPD34X
Wafer Form
• 100% tested with rejects inked
• Use - WN suffix when ordering
60V, 10A
Schottky Rectifier Chip
Packing Information
ESD Protective Lid
Anti-Static Foam
Sawn Wafer
• Available on metal frame or plastic ring
• 100% tested with rejects inked.
• Mounted on adhesive membrane on a metal frame or
plastic ring.
• Use - WS suffix when ordering for metal frame
• Use - WR suffix when ordering for plastic ring.
Anti-Static Foam
Anti-Static Foam
Anti-Static
Polyethylene Protective Layer
Wafer
Anti-Static
Polyethylene Protective Layer
Anti-Static Foam
Sawn Wafer
Adhesive Membrane
Metal Frame
ESD Protective Container
Sawn Wafer
Adhesive Membrane
Plastic Ring
Chip Form
• Waffle Packed.
• Use: -CT, -CM, -CTO suffix when ordering.
• -CT (100% tested with rejects removed).
• -CM (100% tested and 100% visually inspected per
MIL-STD -750, [method 2072 transistors]
[method 2073 diodes] with rejects removed).
• -CTO (100% tested with rejects removed,
die orientation as specified by customer.)
ESD Protective Cover
Anti-Static Polyethylene
Protective Layer
ESD Protective Chip Tray
Innovative Discrete
Semiconductors
For further information contact:
Sales at Central Semiconductor Corp.
[phone] or visit our website at:
www.centralsemi.com
145 Adams Avenue _• Hauppauge _• New York _• 11788 _• USA _• Tel:[phone] _• Fax:[phone]
PB CPD31X