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CMLDM5757_13 Datasheet, PDF (1/3 Pages) Central Semiconductor Corp – SURFACE MOUNT SILICON DUAL P-CHANNEL ENHANCEMENT-MODE MOSFET
CMLDM5757
SURFACE MOUNT SILICON
DUAL P-CHANNEL
ENHANCEMENT-MODE
MOSFET
w w w. c e n t r a l s e m i . c o m
DESCRIPTION:
The CENTRAL SEMICONDUCTOR CMLDM5757
consists of dual P-Channel enhancement-mode silicon
MOSFETs designed for high speed pulsed amplifier
and driver applications. These MOSFETs offer very low
rDS(ON) and low threshold voltage.
MARKING CODE: 77C
SOT-563 CASE
APPLICATIONS:
• Load switch/Level shifting
• Battery charging
• Boost switch
• Electro-luminescent backlighting
FEATURES:
• ESD protection up to 1800V (Human Body Model)
• 350mW power dissipation
• Very low rDS(ON)
• Low threshold voltage
• Logic level compatible
• Small, SOT-563 surface mount package
• Complementary dual N-Channel device: CMLDM3737
MAXIMUM RATINGS: (TA=25°C)
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Steady State)
Maximum Pulsed Drain Current (tp=10μs)
Power Dissipation (Note 1)
Power Dissipation (Note 2)
Power Dissipation (Note 3)
Operating and Storage Junction Temperature
Thermal Resistance (Note 1)
SYMBOL
VDS
VGS
ID
IDM
PD
PD
PD
TJ, Tstg
ΘJA
ELECTRICAL CHARACTERISTICS PER TRANSISTOR: (TA=25°C)
SYMBOL
TEST CONDITIONS
MIN
IGSSF, IGSSR VGS=4.5V, VDS=0
IDSS
VDS=16V, VGS=0
BVDSS
VGS=0, ID=250μA
20
VGS(th)
VDS=VGS, ID=250μA
0.45
VSD
VGS=0, IS=350mA
rDS(ON)
VGS=4.5V, ID=430mA
rDS(ON)
VGS=2.5V, ID=300mA
rDS(ON)
VGS=1.8V, ID=150mA
Crss
VDS=16V, VGS=0, f=1.0MHz
Ciss
VDS=16V, VGS=0, f=1.0MHz
Coss
VDS=16V, VGS=0, f=1.0MHz
Notes: (1) Ceramic or aluminum core PC Board with copper mounting pad area of 4.0mm2
(2) FR-4 Epoxy PC Board with copper mounting pad area of 4.0mm2
(3) FR-4 Epoxy PC Board with copper mounting pad area of 1.4mm2
20
8.0
430
750
350
300
150
-65 to +150
357
MAX
2.0
1.0
1.0
1.2
0.9
1.2
2.0
20
175
30
UNITS
V
V
mA
mA
mW
mW
mW
°C
°C/W
UNITS
μA
μA
V
V
V
Ω
Ω
Ω
pF
pF
pF
R2 (5-June 2013)