UPG2314T5N_V1 Datasheet, PDF (9/10 Pages) California Eastern Labs – POWER AMPLIFIER FOR BluetoothTM Class 1

PG2314T5N
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220C or higher
Preheating time at 120 to 180C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 260C or below
: 10 seconds or less
: 60 seconds or less
: 12030 seconds
: 3 times
: 0.2%(Wt.) or below
IR260
Wave Soldering
Peak temperature (molten solder temperature)
: 260C or below
W S260
Time at peak temperature
: 10 seconds or less
Preheating temperature (package surface temperature) : 120C or below
Maximum number of flow processes
: 1 time
ended ^{Partial Heating}
Maximum chlorine content of rosin flux (% mass)
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
: 350C or below
: 3 seconds or less
: 0.2%(Wt.) or below
NoFt _{oRreNcoewmmDesign} ^{Caution Do not use different soldering methods together (except for partial heating).}
HS350
Data Sheet PG10624EJ02V0DS
9