MC-7831-HA Datasheet, PDF (2/3 Pages) California Eastern Labs – NECs 1 GHz GaAs CATV 18 dB PUSH-PULL AMPLIFIER

ELECTRICAL CHARACTERISTICS (TA = 30±5 °C, VDD = 24 V, ZS = ZL = 75 Ω)
IDD
Operating Current
mA
180
–
240
CTB
Composite Triple Beat
dBc
–
–
-57
XMod Cross Modulation
dBc
–
–
-50
CSO
Composite Second Order
dBc
–
–
-57
MC-7831-HA
RF OFF
f = 40 to 870 MHz; 110 Channels,
VOUT = 44 dBmV, Flat
ABSOLUTE
MAXIMUM RATINGS¹ (TCASE= 30 °C)
SYMBOLS PARAMETERS
UNITS RATINGS
VDD
Supply Voltage
V
30
VI
Input Voltage²
dBmV
65
TC
Operating Case Temperature °C -30 to +100
TSTG
Storage Temperature
°C -40 to +100
Note:
1. Operation in excess of any one of these parameters may result in
permanent damage.
2. Maximum single channel power applied to the input for 1 minute
with no measurable degradation in performance.
RECOMMENDED
OPERATING CONDITIONS (Zs = ZL = 75Ω)
SYMBOLS PARAMETERS
UNITS MIN TYP MAX
VDD

Supply Voltage
V
MC-7831-HA 23.5 24.0 24.5
Vi

Input Voltage¹
dBmV
MC-7831-HA
– 21.0 27.5
TC


Operating Case
°C
Temperature
MC-7831-HA -30 +25 +85
Note:
1. Test Conditions: 110 Channels, Flat
ORDERING INFORMATION
PART NUMBER
Package
QUANTITY
MC-7831-HA-AZ 7-pin special with heatsink 50pcs max/ Tray
NOTES ON CORRECT USE
1. The space between PC board and root of the lead should be kept
more than 1 mm to prevent undesired stress on the lead and also
should be kept less than 4 mm to prevent undesired parasitic
inductance.
Recommended space is 2.0 to 3.0 mm typical.
2. Recommended torque strength of the screw is 59 to 78 Ncm.
3. Form the ground pattern as wide as possible to minimize ground
impedance. (to prevent undesired oscillation)
All the ground pins must be connected together with wide ground
pattern to decrease impedance difference.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended
conditions. Other soldering methods and conditions than the recom-
mended conditions are to be consulted with our sales representa-
tives.
Soldering
Method
Soldering
Conditions
Condition
Symbol
Pin Part Heating


Pin area temperature: less
–
than 260°C¹
Hour: Within 2 sec./pin
Note.
1. The point of pin part heating must be kept at a distance of more
than 1.2 mm from the root of lead.
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these prod
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
ucts can reasonably
so at their own risk and
10/03/2005
A Business Partner of NEC Compound Semiconductor Devices, Ltd.