CM1402 Datasheet, PDF (8/8 Pages) California Micro Devices Corp – SIM Card EMI Filter Array with ESD Protection

CM1402
CSP Mechanical Specifications
CM1402 devices are packaged in a custom Chip Scale
Package (CSP). Dimensions are presented below. For
complete information on CSP packaging, see the Cali-
fornia Micro Devices CSP Package Information docu-
ment.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
10
Millimeters
Inches
Dim
Min Nom Max Min Nom Max
A1 1.915 1.960 2.005 0.0754 0.0772 0.0789
A2 1.285 1.330 1.375 0.0506 0.0524 0.0541
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.180 0.230 0.280 0.0071 0.0091 0.0110
C2 0.180 0.230 0.280 0.0071 0.091 0.0110
D1 0.575 0.644 0.714 0.0226 0.0254 0.0281
D2 0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B2
B1
C
B
A
1234
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
OptiGuard^TM
Coating
D1
D2
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1402
Chip Scale Package
CSP Tape and Reel Specifications
PART NUMBER
CM1402
CHIP SIZE (mm)
1.96 X 1.33 X 0.644
POCKET SIZE (mm)
B₀ X A₀ X K₀
2.08 X 1.45 X 0.711
TAPE WIDTH
W
8mm
REEL
DIAMETER
178mm (7")
QTY PER
REEL
3500
P₀
4mm
P₁
4mm
Top
Cover
Tape
K_o
P_o
A_o
B_o
10 Pitches cumulative
±^{to0le.2ramncme on tape}
W
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P₁
User direction of feed
Center lines
of cavity
Figure 9. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.cmd.com 11/02/05