CM1406 Datasheet, PDF (7/7 Pages) California Micro Devices Corp – 4 Channel EMI Filter Array with ESD Protection

Mechanical Details
TDFN-08 Mechanical Specifications
Dimensions for CM1406 device packaged in an 8-lead
TDFN package are presented below.
For complete information on the TDFN-08 package,
see the California Micro Devices TDFN Package Infor-
mation document.
PACKAGE DIMENSIONS
Package
JEDEC
No.
Leads
Dim.
A
A1
A2
A3
b
D
D2
E
E2
e
K
L
L2
R
r1
# per
tube
# per
tape and
reel
TDFN
MO-229 (Var. VCCD-3)^✝
8
Millimeters
Inches
Min Nom Max Min Nom Max
0.80 0.90 1.00 0.031 0.035 0.039
0.00 0.02 0.05 0.000 0.001 0.002
0.55 0.65 0.80 0.022 0.026 0.031
0.20
0.008
0.18 0.25 0.30 0.007 0.010 0.012
2.00
0.079
0.88 0.98 1.08 0.035 0.039 0.043
2.00
0.079
0.46 0.56 0.66 0.018 0.022 0.026
0.50
0.020
0.20
0.008
0.20 0.30 0.45 0.008 0.012 0.018
0.13
0.005
0.075
0.003
0.075
0.003
NA
3000 pieces
Controlling dimension: millimeters
✝_{This package is compliant with JEDEC standard MO-229, variation}
VCCD-3 with exception of the "D2" and "E2" dimensions as called
out in the table above and the "r1" dimension which is not specified in
the MO-229 standard.
CM1406
Mechanical Package Diagrams
D
8765
Pin 1
Marking
0.10 C
0.08 C
A1
1234
TOP VIEW
SIDE VIEW
A A3 A2
1234
D2
r1
GND PAD
L
R
K
8765
e
BOTTOM VIEW
b
8X
0.10 M C A B
Package Dimensions for 8-Lead TDFN
© 2004 California Micro Devices Corp. All rights reserved.
08/16/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.calmicro.com 7