CM1203 Datasheet, PDF (7/7 Pages) California Micro Devices Corp – 1, 2 and 3-Channel ESD Arrays in CSP

CM1203
Mechanical Details
CSP Mechanical Specifications
CM1203 devices are packaged in a custom Chip Scale
Package (CSP). Dimensions are shown below. For
complete information on CSP packaging, see the Cali-
fornia Micro Devices CSP Package Information docu-
ment.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
4
Millimeters
Inches
Dim
Min Nom Max Min Nom Max
A1 0.881 0.925 0.971 0.0347 0.0365 0.0382
A2 1.015 1.060 1.105 0.0400 0.0417 0.0435
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.495 0.500 0.505 0.0195 0.0197 0.0199
C1 0.163 0.213 0.263 0.0064 0.0084 0.0104
C2 0.230 0.280 0.330 0.0091 0.0110 0.0130
D1 0.600 0.670 0.739 0.0236 0.0264 0.0291
D2 0.394 0.445 0.495 0.0155 0.0175 0.0195
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B1
OptiGuard^TM
Coating
B
A
12
0.30 DIA.
D1
63/37 Sn/Pb (Eutectic) or
D2
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1203 Chip Scale Package
CSP Tape and Reel Specifications
PART NUMBER
CM1203
CHIP SIZE (mm)
1.06 X 0.93 X 0.670
POCKET SIZE (mm)
B₀ X A₀ X K₀
1.14 X 1.00 X 0.70
TAPE WIDTH
W
8mm
REEL
DIAMETER
178mm (7")
QTY PER
REEL
3500
P₀
P₁
4mm 4mm
Top
Cover
Tape
K_o
P_o
A_o
B_o
10 Pitches Cumulative
Tolerance On Tape
±0.2 mm
W
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P₁
User Direction of Feed
Center Lines
of Cavity
Figure 9. Tape and Reel Mechanical Data
© 2004 California Micro Devices Corp. All rights reserved.
06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.calmicro.com 7