CM1203 Datasheet, PDF (2/7 Pages) California Micro Devices Corp – 1, 2 and 3-Channel ESD Arrays in CSP

CM1203
PACKAGE / PINOUT DIAGRAMS
TOP VIEW
(Bumps Down View)
Orientation
Marking
(see note 2)
12
A
n*
B
BOTTOM VIEW
(Bumps Up View)
A2 A1
B2 B1
Orientation
Marking
* See ordering information for
appropriate part marking.
CM1203
4-Bump CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
3) All 4 bumps are always present. Unused bumps are electrically unconnected.
Ordering Information
PART NUMBERING INFORMATION
Bumps
4
4
4
Package
CSP
CSP
CSP
Standard Finish
Ordering Part
Number¹
Part Marking
CM1203-01CS
P
CM1203-02CS
Q
CM1203-03CS
R
Lead-free Finish²
Ordering Part
Number¹
Part Marking
CM1203-01CP
P
CM1203-02CP
Q
CM1203-03CP
R
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2004 California Micro Devices Corp. All rights reserved.
2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.calmicro.com 06/28/04