CM1425 Datasheet, PDF (6/7 Pages) California Micro Devices Corp – 4 Channel EMI Filter Array with ESD Protection

PRELIMINARY
CM1425
Mechanical Details
CM1425 devices are packaged in a custom Chip Scale
Packages (CSP) and available with optional Opti-
Guard™ coating.
.
CM1425 9-bump CSP Mechanical Specifications
The CM1425 devices are packaged in a 9-bump cus-
tom Chip Scale Package (CSP). Dimensions are pre-
sented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
9
Millimeters
Dim
Min Nom Max
Inches
Min Nom Max
A1 0.925 0.970 1.015 0.0364 0.0382 0.0400
A2 2.425 2.470 2.515 0.0955 0.0972 0.0990
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.495 0.500 0.505 0.0195 0.0197 0.0199
C1 0.185 0.235 0.285 0.0073 0.0093 0.0112
C2 0.185 0.235 0.285 0.0073 0.0093 0.0112
D1¹ 0.562 0.606 0.650 0.0221 0.0239 0.0256
D2¹ 0.356 0.381 0.406 0.0140 0.0150 0.0160
D3² 0.600 0.670 0.739 0.0236 0.0264 0.0291
D4² 0.394 0.445 0.495 0.0155 0.0175 0.0195
# per tape
and reel
3500 pieces
Controlling dimension: millimeters
Note 1: Applies to uncoated devices only.
Note 2: Applies to OptiGuard (coated) devices only.
Mechanical Package Diagrams
Non-coated CSP
BOTTOM VIEW
A1
C1
B1
5
4
3
2 BA
1
BA
D1
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
D2
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
OptiGuard™ Coated CSP
BOTTOM VIEW
A1
C1
B1
OptiGuard^TM
Coating
5
4
3
2 BA
1
BA
D3
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
D4
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions
CM1425 9-bump Chip Scale Package
© 2004 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: [phone] ▲ Fax: [phone] ▲ www.calmicro.com 04/21/04