CM1206 Datasheet, PDF (6/7 Pages) California Micro Devices Corp – ESD Protection Arrays, Chip Scale Package

CM1206
Mechanical Details (cont’d)
CM1206-08 10-bump CSP Mechanical Specifications
The CM1206-08 devices are packaged in a 6-bump
custom Chip Scale Package (CSP). Dimensions are
presented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
10
Millimeters
Inches
Dim
Min Nom Max Min Nom Max
A1 1.109 1.154 1.199 0.0437 0.0454 0.0472
A2 3.059 3.104 3.149 0.1204 0.1222 0.1240
B1 0.645 0.650 0.655 0.0254 0.0256 0.0258
B2 0.645 0.650 0.655 0.0254 0.0256 0.0258
C1 0.202 0.252 0.302 0.0080 0.0099 0.0119
C2 0.202 0.252 0.302 0.0080 0.0099 0.0119
D1 0.638 0.707 0.776 0.0251 0.0278 0.0306
D2 0.394 0.445 0.495 0.0155 0.0175 0.0195
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B1
OptiGuard^TM
Coating
5
4
3
2 BA
1
BA
0.35 DIA.
63/37 Sn/Pb (Eutectic) or
D1
D2
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
SIDE
VIEW
Package Dimensions for
CM1206-08 10-bump Chip Scale Package
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
CM1206-08
3.104 X 1.154 X 0.707
POCKET SIZE (mm)
B₀ X A₀ X K₀
3.28 X 1.32 X 0.81
TAPE WIDTH
W
8mm
REEL
DIAMETER
178mm (7")
QTY
PER
REEL
3500
P₀
4mm
P₁
4mm
Top
Cover
Tape
K_o
P_o
A_o
B_o
10 Pitches Cumulative
Tolerance On Tape
±0.2 mm
W
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P₁
User Direction of Feed
Center Lines
of Cavity
Figure 5. Tape and Reel Mechanical Data
© 2004 California Micro Devices Corp. All rights reserved.
6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: [phone] ● Fax: [phone] ● www.calmicro.com 06/28/04